Busch Presents Vacuum Solutions for Semiconductor Fabs at SEMICON Korea 2025
04-01-2025
The Busch Group presented its comprehensive portfolio for the semiconductor industry at SEMICON Korea 2025.
Visitors had the opportunity to discuss vacuum pumps, contamination management solutions (CMS), leak detectors, valves, gas abatement solutions, and comprehensive sub-fab management with experts from Busch Vacuum Solutions and Pfeiffer Vacuum+Fab Solutions. Under these two brands, the Busch Group offers high-quality vacuum solutions for semiconductor fabs, from cleanroom to exhaust, optimizing manufacturing processes with precision, reliability, and efficiency.
New fab model displays semiconductor solutions
For the first time, a new 3D-printed model of a semiconductor fab was presented to display equipment examples. It showcases Pfeiffer’s comprehensive offer for all fab floors in miniature format, such as turbomolecular vacuum pumps, valves, gauges, leak detectors, and contamination management solutions (CMS) for the cleanroom and multi-stage rotary lobe vacuum pumps for the sub-floor. For the basement, gas abatement systems, dry screw vacuum pumps, and further leak detectors as well as multi-stage rotary lobe vacuum pumps are displayed in this model.
Vacuum pumps for the semiconductor industry
In addition to the fab model, several vacuum pumps were showcased. The HiPace 3400 IT turbomolecular vacuum pump from Pfeiffer Vacuum+Fab Solutions is ideal for challenging applications in ion implantation. It is the most compact turbopump in its class.
The TORRI BD 0600 is an oil-free multi-stage rotary lobe vacuum pump, offering short pump-down times for load lock chambers and featuring a small, light, energy-efficient design.
When robustness combined with low energy requirements is needed, the UltiDry comes into play. This multi-stage dry vacuum pump is well suited for harsh applications. It is engineered to enhance powder management and to handle high inlet flow while withstanding corrosive gases and offering lower power consumption under harsh operation.
High-temperature thermal abatement systems combine the wide process coverage of flame abatement with the fuel-free aspects of plasma abatement. The systems feature lower operating costs and secondary emissions, and are capable of destroying the molecular process gas NF3 at class-leading levels with extremely low NOx emissions. They provide a sustainable solution with a minimal carbon footprint for the CVD and metal-etch processes.
Many visitors took the opportunity to visit the Busch Group booth and to exchange about future semiconductor market trends, technology, and developments with the experts.
Experts of the Busch Group presented innovative solutions for the semiconductor industry at SEMICON Korea 2025. Source: Busch Group
